There are few applications in the industrial or consumer market that cannot be improved with the use of wirelessly connected sensors to enhance the user experience or efficiency. Ambient data monitoring can be leveraged to improve security and health or simply the user's lifestyle. When combined with low-power wireless connectivity technology like Bluetooth low energy to communicate with a mobile device, data monitoring becomes a convenient part of daily life. This keynote will discuss the solution approach combining low-power wireless connectivity, ultra-low-power processing and embedded FRAM memory technologies using real-life examples and will include a demonstration of TI's Bluetooth low energy SensorTag, an easy-to-use and low cost development tool for connected sensors.
About Volker Prüller
Volker Prüller is the Marketing Director for TI's Low Power RF group in the Wireless Connectivity business. Volker joined Texas Instruments in 1999 on the European Graduate Program with different responsibilities in the product marketing area in TI's Semiconductor Group, including an assignment in the Wireless Terminals Business Unit in France and in the worldwide MSP430 marketing organization in Dallas, Texas. In 2001, he joined the MSP430 group in Freising, Germany, as product marketing engineer. In July 2007, Volker took the lead of the combined MSP430 and Low Power Wirelss business development activities in EMEA and from January to September 2009 he was managing all MCU and Low Power RF marketing activities in EMEA. In September 2009, Volker moved to Oslo, Norway, where he is heading the worldwide marketing activities for the Low Power RF group of Texas Instruments' Wireless business. Volker holds a Master's level degree in Electrical Engineering from the University of Erlangen-Nuremberg, Germany. He is married and has two children.
The breathtaking growth of MEMS sensors for various applications has created an unprecedented demand for these sensors. The integration of an accelerometer, a gyroscope, a magnetometers and a pressure sensor offers increased degrees of freedom enabling exciting new applications. This presentation will discuss the emerging applications of integrated sensors in consumer electronics, automotive and medical markets.
About Jay Esfandyari
Jay Esfandyari has more than 20 years of industry experience in Semiconductor Technology, Integrated Circuits Fabrication Processes, MEMS development and fabrication, and strategic MEMS market and business development. In the capacity of MEMS Product Marketing Manager at STMicroelectronics, Jay Esfandyari has developed new markets for MEMS products and achieved multi-million dollar business opportunities. In his previous roles, Jay worked closely with customers to develop custom MEMS products, developed models to describe the physics of defect generation in silicon wafer during device fabrication processes, created solutions to perform analysis and computer simulation to improve the quality of silicon wafers. Jay Esfandyari holds a master's degree and a Ph.D. in Electrical Engineering from the University of Technology of Vienna, Austria.
Magnetic sensors are starting to show up everywhere in the real world – in game consoles, smart phones, TV remotes, and personal training devices. But are they worth all the trouble to incorporate? PNI Sensor Corporation President & CEO Becky Oh brings her unique perspective and expertise to this essential question.
About Becky Oh
Throughout her 13 years with PNI Sensor Corporation, Becky Oh has held a range of senior-level positions, from operations to technical business development. She received an M.S. degree in Electrical Engineering from Cornell University, and a B.S. in Electrical Engineering and Computer Science from MIT. Her keen direction and technical knowledge has guided PNI Sensor Corporation's successful integration of its magneto-inductive sensor technology into dozens of state-of-the-art commercial and military applications. These products range from position sensors for TALON tactical robots, to attitude heading reference systems for NOAA's deep-water buoys, to large-scale consumer applications such as the digital compasses found in Ford, GM and Chrysler automobiles. Ms. Oh holds multiple patents in the area of devices with multi-sensing and reporting capabilities.
These non-quartz oscillators are gradually penetrating the $4B frequency reference marketplace and are increasingly being favored by system designers. We will discuss major application trends and address why alternative solutions to quartz are gaining traction. We will also discuss what does it take to get a MEMS product from paper to production including key lessons learned during development.
About Harmeet Bhugra
Harmeet Bhugra is a Managing Director at IDT and is responsible for the vision, growth and general management of the MEMS business. He and his team are credited with an aggressive and ground-breaking development of world's first and smallest Piezoelectric MEMS Oscillator products. With over 15 years of experience, Harmeet has been a serial intrapreneur and has led and delivered on world class innovations. He hold 12 US patents and was recently awarded the distinguished inventor award at IDT. Harmeet has given multiple talks at industry forums and has been the primary editor of published international standards, contributor and author for multiple papers and technical articles. He was also the founder and CEO of a startup, Integral Sight and served as a Vice-Chairman for the Network Processing Forum Board of Directors (BoD). Prior to joining IDT Harmeet held design positions at Nortel Networks and PMC-Sierra in Canada. Harmeet holds Bachelor of Engineering degree from University of Victoria, Canada, Masters in Systems Engineering and MBA degrees (Magna Cum Laude) from San Jose State University and Managing Technical Organization certifications from MIT.
Wide bandgap semiconductor materials are inherently temperature-tolerant, radiation-hardened and chemically inert, which can extend the operation regime of micro- and nano-scale sensors to extreme harsh environments (e.g. deep space, subsurface environments, combustion environments and the human body). In this talk, compelling results of silicon carbide (SiC), gallium nitride (GaN) and aluminum nitride (AlN) sensor operation at temperatures as high as 600C is reviewed.
About Debbie G. Senesky
Debbie G. Senesky received the Ph.D. degree in mechanical engineering from the University of California, Berkeley, in 2007. From 2007 to 2008, she was a Design Engineer for GE Sensing (formerly known as NovaSensor). From 2008 to 2012, she was a postdoctoral researcher at the Berkeley Sensor and Actuator Center developing silicon carbide (SiC) sensing technology for extreme harsh environments. Recently, she has been appointed to the faculty in the Aeronautics and Astronautics Department at Stanford University. Her research interests include the development of micro- and nano-scale sensors, wide bandgap electronics and ceramic materials for operation within extreme harsh environments.
What's wrong with sensor fusion? Why do we need to expand our view of this fundamental capability and in which direction do we go? This presentation will help you understand the requirements, challenges and the ecosystem for enabling context aware mobile devices and applications.
About Tim Kelliher
With over 17 years experience in the Silicon Valley, Tim leads Movea Inc's Technical Business Development group focusing on strategic partnerships that take advantage of Movea's unique intellectual property. Prior to Movea, as an entrepreneur in residence at Skymoon Ventures Tim was the founder Pedestal Networks and was awarded numerous patents. Tim held senior engineering management positions at Dash Navigation, Pedestal Networks, Promatory Communications and Diba Inc (acquired by RIM, UTStarcom , Nortel Networks and Sun Microsystems respectively). Tim holds a BSEE from the University of Colorado, Boulder.
This talk will give an overview of recurring challenges in multi-site, multi-disciplinary MEMS development collaboration. Issues like hampered collaborative recipe knowledge management, challenged virtual verification and missing experimental data oversight and repetitive experimentation will be highlighted. Based on a collaborative development methodology and framework of software tools some solutions are proposed able to reduce time to market and improve the collaboration between foundries and MEMS design houses.
About Dirk Ortloff
Dr. Dirk Ortloff co-founded Process Relations in 2007 - a software and service company offering solutions supporting the area of fabrication process development. He has specialised in process development technology and product engineering for high-tech industries within the semiconductor, photovoltaic and thin film manufacturing sectors. Prior to his engagement at Process Relations, he was ICT & PE Manager at Cavendish Kinetics and System Analyst at T-Systems GEI, he was also a Project Manager at Toll Collect. In 1995 he received his diploma in computer science from the University of Dortmund and undertook, next to his managerial engagements, a doctorate in 2006 about XperiLink, one of the modules of the software suite XperiDesk offered by Process Relations.
Today's media-savvy consumers routinely access media from many sources and are growing increasingly impatient with the constraints that plague device-oriented entertainment (where the physical device controls access to the content). The Internet has also changed consumer expectation and rendered the selection tools of traditional TV entertainment obsolete—from the linear program guide to multi-button remotes. Fortunately, advanced motion sensors are becoming prevalent in many CE products and are more central to the user experience therein. By using motion technology as a core utensil, it is possible to dramatically improve usability and therefore enable improved device navigation and interactivity in Smart TVs, smartphones and tablets, game consoles, set-top boxes, PCs, and more. This session explores flexible, practical and cost efficient motion solutions for the majority of CE use-cases, and demonstrates how motion will be a dominant utensil in the implementation of content discovery, device navigation and interactivity across a wide range of devices and platforms in the coming years.
About Stephen Scheirey
Steve Scheirey is responsible for development of Hillcrest Labs' TV software and services products. Steve has a diverse background in consumer electronics, Web and mobile applications, telecommunications, and defense industries. He has more than 20 years of experience in engineering, software development, and systems architecture. Steve has a record of accomplishments for innovative startup companies. Steve is a founding member of Hillcrest and has a hands-on role in software development, project management, and technical leadership. Prior to Hillcrest, Steve was a software manager and technical contributor at Tellabs and SALIX technologies where he helped architect and develop one of the world's first high density VOIP switches. Steve began his engineering career at Johns Hopkins University Applied Physics Laboratory (APL), a not-for-profit center, known for addressing complex research, engineering, and analytical problems. Steve helped develop and launch integrated command and control systems for the surface Navy fleet. Steve is a U.S. patent holder and inventor on numerous patent- pending applications. Steve earned a bachelor of science in electrical engineering from Cornell University and a master of science in computer science from The Johns Hopkins University.
This session presents a scalable processor based approach to integrate a multitude of sensors into a smart sensor system or sensor hub. The presentation will show how to best deal with key requirements like low power, small area and low footprint Software not only provides flexibility. It also provides a means to realize sensor fusion.
About Paul Garden
Paul is a senior Marketing Manager with 20 years of experience in the field of CPU Processor IP and 8, 16 and 32-Bit Microcontrollers. Paul holds an honors degree in Electronic Engineering from the University of Plymouth (UK). Paul started his career writing digital ASIC test software at GEC Plessey for 3 years and then moved into the field of microcontrollers with 4 years at Avnet (UK) supporting 8/16/32-bit microcontrollers and managing a team of 7 FAEs. Paul then moved into the exciting world of CPU processor IP with 4½ years at ARM Ltd in Cambridge UK. He was notably the original Product Marketing Manager for the Cortex M3 MCU Core and also the ARM926EJ-S Application Processor CPU. Since then Paul had a 6 ½ year stint at leading 8-bit microcontroller company Microchip and more recently with #1 microcontroller vendor Renesas, where he was marketing their 8, 16 and 32-bit microcontroller products. Paul most recently holds the position of Product Marketing Manager for ARC IP Cores at Synopsys in Mountain View.'
The phenomenon called Residual Bulk Image ("RBI") was studied in a large format scientific CCD (KAF09000) image sensor. Operating at –20 C, ghost images were observed in dark images taken hours after a photographic image exposure. This is an undesirable image sensor characteristic and can cause significant problems in some applications such as long exposure scientific imaging applications. The relationship of dark shot noise versus exposure time at various operating tempertures for this RBI-mitigation approach was examined using an Arrhenius plot. For half hour exposures with a target 5 e- dark shot noise limit, an operating temperature of –87.8 C was projected. The fixed patterns caused by the non-uniform trap distribution can cause images to be uncalibratable if high signal level flat-field images are taken prior to taking long exposure images unless RBI-mitigation is used.
About Richard Crisp
Richard Crisp is Vice president and Chief Technologist at Invensas Corporation, a wholly owned subsidiary of Tessera Technologies, Inc. (Nasdaq: TSRA). Crisp is responsible for product strategy, development and promotion of Invensas' semiconductor packaging technologies with a particular focus on advanced system integration structures. Prior to Invensas, Crisp worked for Motorola Semiconductor, Intel, MIPS Computer Systems and Rambus. Crisp began his design career at Motorola Semiconductor as a key circuit designer for the Motorola MC68000 Microprocessor. He also led the DRAM design teams that created the first two generations of RAMBUS DRAMs, introducing a number of fundamental inventions now in common usage throughout the DRAM industry. Crisp was the Program Committee Chairman and Vice Chair for IEEE's International Solid State Circuits Conference (ISSCC 2000 and ISSCC 1999). He was also the ISSCC Memory Subcommittee Chairman. Crisp has authored numerous peer-reviewed papers for IEEE and SPIE journals and conferences. Crisp has been awarded 23 US Patents and has another 24 published US Patent applications. He received his Bachelor's degree, with Cum Laude honors, in Electrical Engineering from Texas A&M University in 1976.
About Shane Dyer
Before founding Arrayent, Shane was the co-founder and CTO of Propellerhead Studios, Inc. Prior, Shane was CEO at ActivePhoto, Inc. that pioneered connected digital camera systems for insurance companies. Shane was a VLSI engineer at C-Cube Microsystems and at Rockwell Science Center. Shane holds a B.S. in Computer Systems Engineering from Stanford University. The Arrayent Connect Platform is used by consumer product companies to securely connect their products to smartphone applications at low cost, with a "just works" installation process. Arrayent customers include First Alert, Hunter Fan, LiftMaster, Mattel, and Whirlpool Corporation. Customers have called Arrayent "the Cisco of Small Things."